- Composition: 60/40 Tin/Lead
- Usage/Application: PCB Soldering
- Melting Point: 180 °C
- Brand: bond
- Material Composition: Sn60/Pb40
- Material Melting Temperature: 183-190 °C
- Material type: Bar/Rod/Stick
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SOLDER STICK
- Composition: 60/40 Tin/Lead
- Usage/Application: PCB Soldering
- Melting Point: 180 °C
- Brand: bond
- Material Composition: Sn60/Pb40
- Material Melting Temperature: 183-190 °C
- Material type: Bar/Rod/Stick
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